How long does it usually take to install and debug the surface treatment equipment for the back package of semiconductor lead frame?

The installation and debugging period of the surface treatment equipment for the back package of semiconductor lead frame is affected by factors such as equipment complexity, site preparation, process requirements and personnel experience, and it is usually 4-12 weeks, which can be divided into the following stages:

I. Installation stage (2-4 weeks)

Simple equipment (such as single cleaning/drying equipment): the structure is relatively simple, mainly involving mechanical positioning, pipeline connection and electrical wiring, and the installation period is about 2 weeks.

Complex equipment (such as multi-bath electroplating line and integrated automatic cleaning-electroplating-drying line): it includes multiple bath bodies, precision transmission system, liquid medicine circulation system and waste gas treatment device, and the levelness, coaxiality and pipeline sealing should be strictly controlled, and the installation period is usually 3-4 weeks.

Note: If the ground hardening is not completed in the early stage of the site and the public system (power supply, pure water and waste gas interface) is not in place, it may be extended by 1-2 weeks.

Second, the debugging stage (2-8 weeks)

Single machine function debugging (1-2 weeks)

Verify the basic functions such as transmission, liquid medicine delivery, temperature control, sensor, etc., to ensure that there is no jamming, leakage or abnormal signal. This stage takes a relatively fixed time.

Process parameter debugging (1-6 weeks)

Is the core link of cycle difference:

If the process is mature (such as conventional nickel plating and gold plating), and the equipment has a high degree of matching with the existing process, the parameters (current density, time and solution concentration) can be optimized by small sample test, and the standard can be reached in about 1-2 weeks.

If special processes (such as high-precision alloy coating and thinning coating) are involved, or the equipment is a customized model, it is necessary to repeatedly adjust the anode distribution, spray pressure, transmission speed, etc. to verify the coating uniformity, adhesion and other indicators, which may take 4-6 weeks.

Stability verification (1-2 weeks)

Hundreds of samples are continuously produced at full load, and it is confirmed that the equipment has no parameter drift and low failure rate, and the time at this stage is relatively fixed.

Third, the key influencing factors

Equipment complexity: The debugging period of fully automatic line (including robot loading and unloading and online detection) is 2-3 weeks longer than that of semi-automatic line.

Pre-preparation: the site, public system and materials (chemicals and samples) are not in place in time, which may lead to a cycle extension of more than 30%.

Personnel experience: The debugging team familiar with semiconductor packaging technology can shorten the cycle by 10%-20%.

To sum up, conventional equipment takes about 6-8 weeks, and complex or customized equipment may be extended to 10-12 weeks. It is suggested that the site and materials should be planned in advance, and the debugging milestones (such as the completion of functional debugging, the achievement of process standards and the passing of stability verification) should be clearly defined with the equipment suppliers to control the progress.